WO2007079277A3 - Manufacturing method and device for making an in-mold circuit comprising a chip - Google Patents

Manufacturing method and device for making an in-mold circuit comprising a chip Download PDF

Info

Publication number
WO2007079277A3
WO2007079277A3 PCT/US2006/060442 US2006060442W WO2007079277A3 WO 2007079277 A3 WO2007079277 A3 WO 2007079277A3 US 2006060442 W US2006060442 W US 2006060442W WO 2007079277 A3 WO2007079277 A3 WO 2007079277A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit
wire
poly
chip
poly sheet
Prior art date
Application number
PCT/US2006/060442
Other languages
French (fr)
Other versions
WO2007079277A2 (en
Inventor
Andre Cote
Detlef Duschek
Original Assignee
Checkpoint Systems Inc
Andre Cote
Detlef Duschek
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Checkpoint Systems Inc, Andre Cote, Detlef Duschek filed Critical Checkpoint Systems Inc
Priority to AU2006332590A priority Critical patent/AU2006332590B2/en
Priority to JP2008539151A priority patent/JP4762317B2/en
Priority to CA2628566A priority patent/CA2628566C/en
Priority to EP06849032.5A priority patent/EP1952315B1/en
Priority to CN2006800501954A priority patent/CN101351815B/en
Publication of WO2007079277A2 publication Critical patent/WO2007079277A2/en
Publication of WO2007079277A3 publication Critical patent/WO2007079277A3/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00—Burglar, theft or intruder alarms
    • G08B13/22—Electrical actuation
    • G08B13/24—Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2428—Tag details
    • G08B13/2437—Tag layered structure, processes for making layered tags
    • G08B13/244—Tag manufacturing, e.g. continuous manufacturing processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/79—Apparatus for Tape Automated Bonding [TAB]
    • H01L2224/7965—Means for transporting the components to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
    • Y10T29/4916—Simultaneous circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive

Abstract

A poly sheet continuously moving in a machine direction is heated to a temperature just below its glass thermal temperature to make the poly malleable. A circuit (e.g., RFID chip, EAS chip, transponder, IC) is placed on the poly sheet and embedded into the poly sheet, preferably with a heat resistant soft (e.g., rubber) roller that presses the circuit into the poly without breaking the circuit. A conductive strip or wire may be applied on or into the poly sheet to align with connection points (e.g., conductive bumps) of the circuit for conductive communication with the circuit. The conductive strip or wire is preferably cut to form gaps that are nonconductive between the cut sections of wire to avoid shorting of the circuit and/or allow the conductive strip or wire to function as an antenna for the circuit, and thus to form a chip strap or tag. The poly sheet thus provides a protective womb or shield for the circuit and wire.
PCT/US2006/060442 2005-11-02 2006-11-01 Manufacturing method and device for making an in-mold circuit comprising a chip WO2007079277A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
AU2006332590A AU2006332590B2 (en) 2005-11-02 2006-11-01 Manufacturing method and device for making an in-mold circuit comprising a chip
JP2008539151A JP4762317B2 (en) 2005-11-02 2006-11-01 In-mold chip mounting
CA2628566A CA2628566C (en) 2005-11-02 2006-11-01 In-mold chip attach
EP06849032.5A EP1952315B1 (en) 2005-11-02 2006-11-01 Manufacturing method and device for making an in-mold circuit comprising a chip
CN2006800501954A CN101351815B (en) 2005-11-02 2006-11-01 Manufacturing method and device for making an in-mold circuit comprising a chip

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US73289805P 2005-11-02 2005-11-02
US60/732,898 2005-11-02
US74446106P 2006-04-07 2006-04-07
US60/744,461 2006-04-07
US11/554,237 2006-10-30
US11/554,237 US7621043B2 (en) 2005-11-02 2006-10-30 Device for making an in-mold circuit

Publications (2)

Publication Number Publication Date
WO2007079277A2 WO2007079277A2 (en) 2007-07-12
WO2007079277A3 true WO2007079277A3 (en) 2008-03-20

Family

ID=37996719

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/060442 WO2007079277A2 (en) 2005-11-02 2006-11-01 Manufacturing method and device for making an in-mold circuit comprising a chip

Country Status (7)

Country Link
US (1) US7621043B2 (en)
EP (1) EP1952315B1 (en)
JP (1) JP4762317B2 (en)
CN (1) CN101351815B (en)
AU (1) AU2006332590B2 (en)
CA (1) CA2628566C (en)
WO (1) WO2007079277A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8123896B2 (en) * 2004-06-02 2012-02-28 Semiconductor Energy Laboratory Co., Ltd. Laminating system
TWI311358B (en) * 2005-11-16 2009-06-21 Advanced Semiconductor Eng Flip-chip integrated circuit packaging method
FR2901041B1 (en) * 2006-05-12 2008-10-10 Eric Heurtier LABEL INTEGRATING RF ANTENNA ANTENNA AND UHF RFID CARRIER
HK1109708A2 (en) * 2007-04-24 2008-06-13 On Track Innovations Ltd Interface card and apparatus and process for the formation thereof
WO2009060425A2 (en) * 2007-11-08 2009-05-14 On Track Innovations Ltd. Electronic interface apparatus and method and system for manufacturing same
FR2917895B1 (en) * 2007-06-21 2010-04-09 Commissariat Energie Atomique METHOD FOR MANUFACTURING AN ASSEMBLY OF MECHANICALLY CONNECTED CHIPS USING A FLEXIBLE CONNECTION
US8094027B2 (en) 2007-12-19 2012-01-10 Abbott Laboratories Method for molding an object containing a radio frequency identification tag
US20100301005A1 (en) * 2009-05-29 2010-12-02 Nilsson Peter L J Method of Manufacturing an Electrical Circuit on a Substrate
US20100301006A1 (en) * 2009-05-29 2010-12-02 Nilsson Peter L J Method of Manufacturing an Electrical Component on a Substrate
DE102009056122A1 (en) * 2009-11-30 2011-06-01 Smartrac Ip B.V. Method for contacting a chip
DE112016007152B4 (en) * 2016-08-17 2024-02-01 Mitsubishi Electric Corporation Method for producing a plate-shaped solder and manufacturing device
DE102018005568A1 (en) * 2018-07-13 2020-01-16 Mühlbauer Gmbh & Co. Kg Device and method for producing RFID transponders with a sliding surface

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5708419A (en) * 1996-07-22 1998-01-13 Checkpoint Systems, Inc. Method of wire bonding an integrated circuit to an ultraflexible substrate
US20020152604A1 (en) * 2001-04-23 2002-10-24 Debraal John Charles Method and system for forming electrically conductive pathways
US20050093172A1 (en) * 2003-10-10 2005-05-05 Norihito Tsukahara Electronic circuit device, and method and apparatus for manufacturing the same
US20070102486A1 (en) * 2005-10-24 2007-05-10 Checkpoint Systems, Inc. Wire embedded bridge

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2757443A (en) * 1953-01-21 1956-08-07 Erie Resistor Corp Method of making printed circuits
US2955351A (en) * 1954-12-28 1960-10-11 Plast O Fab Circuits Inc Method of making a printed circuit
US3990142A (en) * 1973-10-02 1976-11-09 Jerobee Industries, Inc. Circuit board, method of making the circuit board and improved die for making said board
US5144600A (en) * 1992-07-05 1992-09-01 Cheng Peter S C Arrangement for and method of waking a sleeper
US5761801A (en) * 1995-06-07 1998-06-09 The Dexter Corporation Method for making a conductive film composite
US6111506A (en) * 1996-10-15 2000-08-29 Iris Corporation Berhad Method of making an improved security identification document including contactless communication insert unit
US6308406B1 (en) * 1998-08-12 2001-10-30 Thermotrax Corporation Method for forming an electrical conductive circuit on a substrate
WO2005015477A2 (en) * 2003-08-08 2005-02-17 Shmuel Shapira Circuit forming system and method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5708419A (en) * 1996-07-22 1998-01-13 Checkpoint Systems, Inc. Method of wire bonding an integrated circuit to an ultraflexible substrate
US20020152604A1 (en) * 2001-04-23 2002-10-24 Debraal John Charles Method and system for forming electrically conductive pathways
US20050093172A1 (en) * 2003-10-10 2005-05-05 Norihito Tsukahara Electronic circuit device, and method and apparatus for manufacturing the same
US20070102486A1 (en) * 2005-10-24 2007-05-10 Checkpoint Systems, Inc. Wire embedded bridge

Also Published As

Publication number Publication date
AU2006332590A1 (en) 2007-07-12
EP1952315B1 (en) 2016-08-17
AU2006332590B2 (en) 2010-07-01
JP2009514703A (en) 2009-04-09
EP1952315A2 (en) 2008-08-06
US7621043B2 (en) 2009-11-24
CA2628566C (en) 2012-01-03
CN101351815B (en) 2011-11-16
CA2628566A1 (en) 2007-07-12
CN101351815A (en) 2009-01-21
JP4762317B2 (en) 2011-08-31
US20070098942A1 (en) 2007-05-03
WO2007079277A2 (en) 2007-07-12

Similar Documents

Publication Publication Date Title
WO2007079277A3 (en) Manufacturing method and device for making an in-mold circuit comprising a chip
WO2004015441A3 (en) Radio frequency identificaton device and method
CN100388305C (en) RFID tag
TW200713075A (en) RFID tag and manufacturing method thereof
WO2006057820A3 (en) Radio frequency identification (rfid) tag for an item having a conductive layer included or attached
WO2010104991A3 (en) Universal rfid tags and manufacturing methods
TW200732977A (en) RFID tag
WO2008051598A3 (en) Radio frequency identification system
WO2011005550A3 (en) Washable rfid device for apparel tracking
WO2007074246A3 (en) Radiofrequency communication method and device
BR112014015108A2 (en) radio frequency identification tag
WO2009004728A1 (en) Rifd tag and manufacturing method of the rifd tag
FR2882174B1 (en) METHOD FOR MANUFACTURING A MICROELECTRONIC DEVICE WITH NON-CONTACT FUNCTIONING, IN PARTICULAR FOR ELECTRONIC PASSPORT
EP2323079A3 (en) Electrical device manufacturing techniques
TW200710736A (en) Radio frequency identification tags for use on metal or other conductive objects
WO2005081182A3 (en) Rfid tag and method of manufacturing the same
FR2790849B1 (en) MANUFACTURING METHOD FOR CONTACTLESS CARD TYPE ELECTRONIC DEVICE
WO2007002459A3 (en) Apparatus and method to electromagnetically shield portable consumer devices
EP2259213A3 (en) RFID device
WO2007064430A3 (en) Identification band using a conductive fastening for enhanced security and functionality
ATE522884T1 (en) LABEL WITH AN HF ANTI-THEFT ANTENNA AND UHF RFID TRANSPONDER
TW200622913A (en) Rfid tag
WO2015128188A3 (en) Rfid transponder chip modules
TW200744256A (en) Radio frequency identification tag and antenna for radio frequency identification tag
NZ592929A (en) Radio frequency identification tag

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: MX/a/2008/005694

Country of ref document: MX

ENP Entry into the national phase

Ref document number: 2008539151

Country of ref document: JP

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 2628566

Country of ref document: CA

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2321/CHENP/2008

Country of ref document: IN

WWE Wipo information: entry into national phase

Ref document number: 2006332590

Country of ref document: AU

REEP Request for entry into the european phase

Ref document number: 2006849032

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2006849032

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 2006332590

Country of ref document: AU

Date of ref document: 20061101

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 200680050195.4

Country of ref document: CN