WO2013016305A3 - Component analysis systems and methods - Google Patents
Component analysis systems and methods Download PDFInfo
- Publication number
- WO2013016305A3 WO2013016305A3 PCT/US2012/047897 US2012047897W WO2013016305A3 WO 2013016305 A3 WO2013016305 A3 WO 2013016305A3 US 2012047897 W US2012047897 W US 2012047897W WO 2013016305 A3 WO2013016305 A3 WO 2013016305A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- component
- metal layer
- vias
- signal transition
- methods
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K3/00—Circuits for generating electric pulses; Monostable, bistable or multistable circuits
- H03K3/02—Generators characterised by the type of circuit or by the means used for producing pulses
- H03K3/027—Generators characterised by the type of circuit or by the means used for producing pulses by the use of logic circuits, with internal or external positive feedback
- H03K3/03—Astable circuits
- H03K3/0315—Ring oscillators
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/31725—Timing aspects, e.g. clock distribution, skew, propagation delay
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Component characteristics analysis systems and methods are described. In one embodiment, a ring oscillator comprises: at least one inversion stage operable to cause a signal transition; a target component that has an increased comparative impact or influence on a signal transition propagation in the ring oscillator; and an output component for outputting an indication of the impact the target component has on the signal transition. The target component can include a plurality of vias from one metal layer to another metal layer. The plurality of vias from one metal layer to another metal layer can be configured in a cell. The vias can correspond to a via layer. In one exemplary implementation, the output is coupled to an analysis component. The analysis component can include correlation of the via resistance into a wafer variations and generate a wafer map. The analysis component can include correlation of the via resistance into a wafer.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE112012003071.0T DE112012003071T5 (en) | 2011-07-22 | 2012-07-23 | Component analysis systems and methods |
CN201280032957.3A CN103650345A (en) | 2011-07-22 | 2012-07-23 | Component analysis systems and methods |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161511021P | 2011-07-22 | 2011-07-22 | |
US61/511,021 | 2011-07-22 | ||
US201161512362P | 2011-07-27 | 2011-07-27 | |
US61/512,362 | 2011-07-27 | ||
US201161513508P | 2011-07-29 | 2011-07-29 | |
US61/513,508 | 2011-07-29 | ||
US13/528,725 US9425772B2 (en) | 2011-07-27 | 2012-06-20 | Coupling resistance and capacitance analysis systems and methods |
US13/528,725 | 2012-06-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2013016305A2 WO2013016305A2 (en) | 2013-01-31 |
WO2013016305A3 true WO2013016305A3 (en) | 2013-03-21 |
Family
ID=47555373
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2012/047897 WO2013016305A2 (en) | 2011-07-22 | 2012-07-23 | Component analysis systems and methods |
Country Status (5)
Country | Link |
---|---|
US (1) | US9496853B2 (en) |
CN (1) | CN103650345A (en) |
DE (1) | DE112012003071T5 (en) |
TW (2) | TWI472781B (en) |
WO (1) | WO2013016305A2 (en) |
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CN103476777B (en) | 2011-01-31 | 2015-05-27 | 诺瓦提斯公司 | Novel heterocyclic derivatives |
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US9425772B2 (en) | 2011-07-27 | 2016-08-23 | Nvidia Corporation | Coupling resistance and capacitance analysis systems and methods |
WO2013061305A1 (en) | 2011-10-28 | 2013-05-02 | Novartis Ag | Novel purine derivatives and their use in the treatment of disease |
US8952705B2 (en) | 2011-11-01 | 2015-02-10 | Nvidia Corporation | System and method for examining asymetric operations |
US9448125B2 (en) | 2011-11-01 | 2016-09-20 | Nvidia Corporation | Determining on-chip voltage and temperature |
TWI491894B (en) * | 2013-12-23 | 2015-07-11 | Azurewave Technologies Inc | A inter-stage test structure for a wireless communication apparatus |
US9485671B2 (en) | 2014-02-27 | 2016-11-01 | Azurewave Technologies, Inc. | Inter-stage test structure for wireless communication apparatus |
US10156605B2 (en) * | 2014-08-29 | 2018-12-18 | Semitronix Corporation | Addressable ring oscillator test chip |
US10935962B2 (en) * | 2015-11-30 | 2021-03-02 | National Cheng Kung University | System and method for identifying root causes of yield loss |
KR101772808B1 (en) * | 2016-03-18 | 2017-08-30 | 연세대학교 산학협력단 | Circuit and method for test and analysis through-silicon-via |
US10515167B2 (en) | 2016-08-05 | 2019-12-24 | Synopsys, Inc. | Cell-aware defect characterization and waveform analysis using multiple strobe points |
CN115130421A (en) | 2021-05-20 | 2022-09-30 | 台湾积体电路制造股份有限公司 | Integrated circuit device |
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-
2012
- 2012-07-23 US US13/556,129 patent/US9496853B2/en active Active
- 2012-07-23 TW TW101126522A patent/TWI472781B/en active
- 2012-07-23 WO PCT/US2012/047897 patent/WO2013016305A2/en active Application Filing
- 2012-07-23 TW TW101126523A patent/TWI592674B/en active
- 2012-07-23 DE DE112012003071.0T patent/DE112012003071T5/en not_active Withdrawn
- 2012-07-23 CN CN201280032957.3A patent/CN103650345A/en active Pending
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KR20010035660A (en) * | 1999-10-01 | 2001-05-07 | 김영환 | A method of measuring delay time due to interconnections |
US20030001185A1 (en) * | 2001-06-29 | 2003-01-02 | Bernhard Sell | Circuit configuration and method for determining a time constant of a storage capacitor of a memory cell in a semiconductor memory |
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Also Published As
Publication number | Publication date |
---|---|
US9496853B2 (en) | 2016-11-15 |
WO2013016305A2 (en) | 2013-01-31 |
DE112012003071T5 (en) | 2014-04-10 |
CN103650345A (en) | 2014-03-19 |
TWI592674B (en) | 2017-07-21 |
TW201323896A (en) | 2013-06-16 |
TWI472781B (en) | 2015-02-11 |
US20130021107A1 (en) | 2013-01-24 |
TW201323900A (en) | 2013-06-16 |
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