US7567133B2 - Phase-locked loop filter capacitance with a drag current - Google Patents

Phase-locked loop filter capacitance with a drag current Download PDF

Info

Publication number
US7567133B2
US7567133B2 US11/400,495 US40049506A US7567133B2 US 7567133 B2 US7567133 B2 US 7567133B2 US 40049506 A US40049506 A US 40049506A US 7567133 B2 US7567133 B2 US 7567133B2
Authority
US
United States
Prior art keywords
circuitry
current
capacitor
loop filter
charge pump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US11/400,495
Other versions
US20070247236A1 (en
Inventor
Randy Caplan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mosaid Technologies Inc
Original Assignee
Mosaid Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mosaid Technologies Corp filed Critical Mosaid Technologies Corp
Priority to US11/400,495 priority Critical patent/US7567133B2/en
Assigned to MOSAID TECHNOLOGIES CORPORATION reassignment MOSAID TECHNOLOGIES CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CAPLAN, RANDY
Priority to PCT/US2007/008474 priority patent/WO2007117543A2/en
Priority to TW096112073A priority patent/TWI419470B/en
Publication of US20070247236A1 publication Critical patent/US20070247236A1/en
Application granted granted Critical
Publication of US7567133B2 publication Critical patent/US7567133B2/en
Assigned to MOSAID TECHNOLOGIES INCORPORATED reassignment MOSAID TECHNOLOGIES INCORPORATED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MOSAID TECHNOLOGIES CORPORATION
Assigned to MOSAID TECHNOLOGIES INCORPORATED reassignment MOSAID TECHNOLOGIES INCORPORATED CHANGE OF ADDRESS Assignors: MOSAID TECHNOLOGIES INCORPORATED
Assigned to ROYAL BANK OF CANADA reassignment ROYAL BANK OF CANADA U.S. INTELLECTUAL PROPERTY SECURITY AGREEMENT (FOR NON-U.S. GRANTORS) - SHORT FORM Assignors: 658276 N.B. LTD., 658868 N.B. INC., MOSAID TECHNOLOGIES INCORPORATED
Assigned to CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC. reassignment CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: MOSAID TECHNOLOGIES INCORPORATED
Assigned to CONVERSANT IP N.B. 868 INC., CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC., CONVERSANT IP N.B. 276 INC. reassignment CONVERSANT IP N.B. 868 INC. RELEASE OF SECURITY INTEREST Assignors: ROYAL BANK OF CANADA
Assigned to CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC. reassignment CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC. CHANGE OF ADDRESS Assignors: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
Assigned to ROYAL BANK OF CANADA, AS LENDER, CPPIB CREDIT INVESTMENTS INC., AS LENDER reassignment ROYAL BANK OF CANADA, AS LENDER U.S. PATENT SECURITY AGREEMENT (FOR NON-U.S. GRANTORS) Assignors: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
Assigned to CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC. reassignment CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC. RELEASE OF U.S. PATENT AGREEMENT (FOR NON-U.S. GRANTORS) Assignors: ROYAL BANK OF CANADA, AS LENDER
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03LAUTOMATIC CONTROL, STARTING, SYNCHRONISATION, OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
    • H03L7/00Automatic control of frequency or phase; Synchronisation
    • H03L7/06Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop
    • H03L7/08Details of the phase-locked loop
    • H03L7/085Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal
    • H03L7/089Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal the phase or frequency detector generating up-down pulses
    • H03L7/0891Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal the phase or frequency detector generating up-down pulses the up-down pulses controlling source and sink current generators, e.g. a charge pump
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03LAUTOMATIC CONTROL, STARTING, SYNCHRONISATION, OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
    • H03L7/00Automatic control of frequency or phase; Synchronisation
    • H03L7/06Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop
    • H03L7/08Details of the phase-locked loop
    • H03L7/085Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal
    • H03L7/093Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal using special filtering or amplification characteristics in the loop

Definitions

  • the present invention relates generally to phase-locked loop circuitry and more particularly to phase-locked loop filter capacitance with a drag current.
  • Filter circuitry may contain capacitors to filter certain frequencies of a signal. Filter circuitry is used in numerous types of electronic circuits.
  • One type of electronic circuit is a phase-locked loop.
  • a phase-locked loop is an electronic circuit with a voltage- or current-driven oscillator that is adjusted to match in phase (and thus lock on) the frequency of an input signal.
  • PLLs are used to generate a signal, modulate or demodulate a signal, reconstitute a signal with less noise, and multiply or divide a frequency. Examples of applications for PLLs include frequency synthesizers for RF local oscillators or digital clock generation, recovery of small signals that otherwise would be lost in noise, lock-in amplifiers, and recovery of clock timing information from a data stream.
  • FIG. 1 illustrates phase-locked loop (PLL) circuitry 100 according to the prior art.
  • Phase-frequency detector (PFD) circuitry 110 generates an “up” signal 115 and a “down” signal 120 by comparing the phase difference of an input signal 105 to a feedback signal 160 .
  • the PFD circuitry 110 outputs the up signal 115 and the down signal 120 depending on whether or not the phase of the feedback signal 160 lags (needs to speed up) or leads (needs to slow down) when compared to the input signal 105 .
  • Charge pump circuitry 125 generates current pulses in a charge pump output signal 130 (e.g., to charge capacitors in loop filter circuitry 135 ) based on the up signal 115 and the down signal 120 .
  • the current pulses generated by the charge pump circuitry 125 have a finite minimum pulse width in order to avoid a “dead-zone” effect. For example, when the input signal 105 and the feedback signal 160 have equal phase, the current pulses of the charge pump output signal 130 have a non-zero equal width. With unequal phase, one of the current pulses of the charge pump output signal 130 is lengthened to correct the phase.
  • the loop filter circuitry 135 low pass filters the charge pump output signal 130 and generates a filtered control signal 140 .
  • Voltage controlled oscillator (VCO) circuitry 145 generates an output signal 150 whose frequency is determined by the voltage of the filtered control signal 140 .
  • the PLL circuitry 100 loops the output signal 150 back to the PFD circuitry 110 as the feedback signal 160 .
  • frequency divider circuitry 155 is placed in the feedback path of the loop to generate the feedback signal 160 and to allow the frequency of the output signal 150 to be a multiple of the input signal 105 .
  • FIG. 2 illustrates loop filter circuitry 135 according to the prior art.
  • the loop filter circuitry 135 depicted in FIG. 2 is an example of a second order loop filter.
  • the loop filter circuitry 135 includes a capacitor 220 , a resistor 230 , and a capacitor 240 .
  • the charge pump circuitry 125 of FIG. 1 is represented in FIG. 2 as a current source 210 .
  • the capacitor 220 is connected to the control voltage node 215 and ground.
  • the resistor 230 is connected to the control voltage node 215 and the capacitor 240 .
  • the capacitor 240 is also connected to ground.
  • the control voltage node 215 is also connected to the voltage controlled oscillator circuitry 145 of FIG. 1 . Due to stability concerns, the capacitor 240 (i.e.
  • the capacitor 240 is usually at least ten times larger than the capacitor 220 (i.e. small capacitor). Increasing the size of the capacitor 240 with respect to the capacitor 220 improves phase margin, which is often desirable. However, it is also desirable to make the capacitor 220 (i.e., small capacitor) as large as possible to reduce the ripple on the control voltage. Therefore, in order to achieve good phase margin and ripple suppression, the capacitor 240 may need to be very large.
  • the loop bandwidth describes characteristics of the PLL such as settling behavior and noise transfer functions.
  • a very low loop bandwidth is desirable to achieve good filtering of reference clock noise and feedback divider noise. This is especially important in fractional-N PLL applications where the value of the feedback divide is constantly changing and large amounts of quantization noise may be introduced into the loop.
  • Low bandwidth is also a requirement for loop stability when low reference clock frequencies are used. It is typically desirable for the loop bandwidth to be at least 10 times lower than that of the reference clock frequency.
  • the reference clock frequency to bandwidth ratios on the order of 100:1 may be used.
  • a PLL designer typically has two alternatives to achieve a lower loop bandwidth.
  • the charge pump current can be decreased.
  • decreasing the charge pump current increases its noise contribution and becomes increasingly difficult to implement at low levels.
  • the other alternative for lowering the loop bandwidth is increasing the size of the loop filter integration capacitor (i.e., big capacitor). Consequently, one limitation is the overall size of the PLL increases because of the increased size of the capacitor.
  • the capacitor 220 is 17.5 pF
  • the capacitor 240 is 280 pF.
  • the big capacitor (i.e., the capacitor 240 ) at 280 pF occupies a significant area on the integrated circuit in order to achieve a low loop bandwidth.
  • Some low bandwidth PLL designs may use off chip discrete components for the loop filter. However, components are increasingly being implemented on-chip to be fully integrated, which further increases the need to minimize area consumed on the integrated circuit.
  • the invention addresses the above problems by providing a phase-locked loop circuitry with drag current circuitry.
  • the phase-locked loop circuitry includes charge pump circuitry, loop filter circuitry, and drag current circuitry.
  • the charge pump circuitry generates a charge pump current based on a phase of an input signal.
  • the loop filter circuitry receives the charge pump current.
  • the drag current circuitry generates a drag current to draw charge in the opposite direction from the charging current from a loop filter integration capacitor in the loop filter circuitry that does not include voltage sensing circuitry.
  • the drag current may be a fraction of the charge pump current.
  • the drag current may be delivered in discrete time.
  • the drag current circuitry is located within the charge pump circuitry.
  • the drag current circuitry may comprise a current source and/or a resistor.
  • the loop filter circuitry may comprise a first capacitor from a control voltage to ground, a resistor from the control voltage to an integration node, and the loop filter integration capacitor from the integration node to the ground and the drag current circuitry may be connected to the integration node.
  • a method for operating phase-locked loop circuitry includes the steps of generating a charge pump current in charge pump circuitry based on a phase of an input signal, receiving the charge pump current into loop filter circuitry, and generating a drag current in drag current circuitry to draw charge in the opposite direction from the charging current from a loop filter integration capacitor in the loop filter circuitry.
  • the drag current circuitry advantageously allows a designer to lower the loop bandwidth without lowering the charge pump current or increasing the capacitor area. Additionally, the charge pump current can be at a more easily managed signal current level rather than being lowered to an unmanageable level. Some embodiments implemented in a PLL have a significant improvement in power supply noise rejection. Some embodiments implemented in a PLL also have another advantage of a “fast locking” behavior.
  • FIG. 1 is an illustration of phase-locked loop circuitry according to the prior art.
  • FIG. 2 is an illustration of loop filter circuitry according to the prior art.
  • FIG. 3 is an illustration of loop filter circuitry in an embodiment of the invention.
  • FIG. 4 is an illustration of charge pump circuitry in one embodiment of the invention.
  • FIG. 5 is a graph of the AC transfer function (i.e., voltage vs. frequency) of a filter in the prior art and a filter in one embodiment of the invention.
  • FIG. 6 is a graph of VCO control voltage vs. time for a filter in the prior art and a filter in one embodiment of the invention.
  • FIG. 7 is a zoomed-in graph of VCO control voltage vs. time for a filter in the prior art and a filter in one embodiment of the invention.
  • FIG. 8 is an illustration of loop filter circuitry in an embodiment of capacitance multiplication.
  • FIG. 9 is an illustration of loop filter circuitry in an embodiment of capacitance multiplication.
  • V voltage
  • Some examples of this circuitry is analog or switched capacitor filter circuitry. Some of this analog or switched capacitor filter circuitry may operate in discrete or continuous time and may be low pass filters.
  • FIG. 3 depicts an illustration of loop filter circuitry 300 in an embodiment of the invention.
  • the loop filter circuitry 300 includes a capacitor 320 , a resistor 330 , and a capacitor 340 .
  • the current source 310 represents charge pump circuitry from PLL circuitry as depicted in FIG. 1 .
  • charge pump circuitry is described in U.S. patent application Ser. No. 11/264,283, entitled “Phase-Locked Loop Circuitry Using Charge Pumps with Current Mirror Circuitry” filed on Oct. 31, 2005, which is hereby incorporated by reference.
  • the capacitor 320 is connected to the control voltage node 315 and ground.
  • the resistor 330 is connected to the control voltage node 315 , N 1 .
  • the resistor 330 is connected to the capacitor 340 at a node called the integration node, N 2 .
  • the capacitor 340 is also connected to ground.
  • the capacitor 320 has a capacitance of 17.5 pF
  • the capacitor 340 has a capacitance of 40 pF.
  • Drag current circuitry 350 is connected to the integration node, N 2 , between the resistor 330 and the capacitor 340 .
  • the drag current circuitry 350 is any electrical component, combination of electrical components, or circuitry configured to generate a drag current that directs charge in the opposite direction from the charging current from a capacitor in filter circuitry.
  • a drag current is any flow of electricity that directs charge in the opposite direction of the charging current from a capacitor in filter circuitry.
  • the drag current, I 2 is a fraction of the charge pump current, I 1 .
  • the capacitor 340 appears larger by a factor of:
  • a PLL circuit sees a capacitor (i.e. capacitor 340 ), which is 10 ⁇ larger than the actual capacitor needed to implement the big capacitance. Therefore, the capacitor (i.e. capacitor 340 ) appears to have a capacitance that is multiplied as compared to its actual capacitance. As a result, smaller capacitance can be used in the loop filter circuitry 300 .
  • the capacitor 340 has a capacitance of 40 pF as compared with the capacitor 240 of FIG. 2 , which has a capacitance of 280 pF.
  • the overall size of the PLL circuitry will be reduced because the capacitance of the loop filter circuitry 300 , specifically the capacitor 340 , consumes less area on an integrated circuit.
  • the drag current circuitry 350 comprises a current source 355 .
  • the current source 355 represents the charge pump circuitry of the PLL.
  • the charge pump circuitry has two outputs: one for charge pump current and the other for the drag current.
  • the drag current, I 2 is a fraction and opposite polarity of the charge pump current, I 1 .
  • the drag current may be generated using current mirrors in the charge pump circuitry, where the ratio of the transistor size in the current mirror is the same as the ratio of I 2 to I 1 .
  • One example of the charge pump circuitry that generates the charge pump current and the drag current is described below in FIG. 4 .
  • the switches in the charge pump circuitry which enable the delivery of current I 2 to node N 2 can be enabled at the exact same time as the switches enabling the delivery of current I 1 to node N 1 .
  • Some embodiments of the charge pump circuitry may include feedback circuitry to ensure that the positive and negative currents are equal in magnitude such as within 1-2% across the allowed control voltage range.
  • the drag current circuitry 350 delivers the drag current in discrete time or continuous time. In discrete time, the drag current circuitry 350 can remove the charge during the sampling period, which has benefits with regards to noise and accuracy.
  • the loop filter circuitry 300 of FIG. 3 does not perform current to voltage to current conversions unlike some prior art circuitries for multiplying capacitance. By not performing the current to voltage to current conversions, the loop filter circuitry 300 can be implemented in low power designs. Also, the loop filter circuitry 300 does not include voltage sensing circuitry such as an amplifier.
  • the drag current circuitry 350 advantageously allows a designer to lower the loop bandwidth without lowering the charge pump current or increasing the capacitor area. Additionally, the charge pump current can be at a more easily managed signal current level rather than being lowered to an unmanageable level.
  • Some embodiments implemented in a PLL have a significant improvement in power supply noise rejection.
  • a prior art PLL typically rejects supply noise below its loop bandwidth and above the “short circuit” impedance of the small loop filter capacitor (i.e., ripple capacitor).
  • ripple capacitor the small loop filter capacitor
  • the ranges at low loop bandwidth will not overlap if the ripple capacitor is too small and a passband is created where supply noise can reach the output.
  • some embodiments have a loop filter short circuit impedance that is reduced below the loop bandwidth without a negative effect on stability. As a result, the entire frequency spectrum of supply noise is filtered out, and jitter is greatly reduced.
  • Some embodiments implemented in a PLL also have another advantage of a “fast locking” behavior.
  • Prior art low bandwidth PLLs typically take a very long time to acquire phase lock.
  • some embodiments reduce the drag current during the acquisition period which effectively increases the bandwidth at a cost of phase margin.
  • the loop remains stable enough to obtain phase lock at which the full drag current may be resumed to implement the low loop bandwidth.
  • FIG. 4 depicts an illustration of charge pump circuitry 400 in one embodiment of the invention.
  • the charge pump circuitry 400 generates the primary current, I primary , and the drag current, I drag .
  • the charge pump circuitry 400 includes a PMOS transistor (MP 1 ) 402 , a current source 404 , a PMOS transistor (MP 2 ) 406 , an NMOS transistor (MN 1 ) 408 , a PMOS transistor (MP 3 ) 410 , a MOS switch (S 1 ) 412 , a MOS switch (S 2 ) 414 , an NMOS transistor (MN 2 ) 416 , a PMOS transistor (MP 4 ) 418 , a MOS switch (S 3 ) 420 , a MOS switch (S 4 ) 422 , and an NMOS transistor (MN 3 ) 424 .
  • PMOS transistor (MP 1 ) 402 a current source 404 , a PMOS transistor (MP 2 ) 406
  • the gate of the PMOS transistor (MP 1 ) 402 is coupled to the drain of the PMOS transistor (MP 1 ) 402 and the gate of the PMOS transistor (MP 2 ) 406 .
  • the drain of the PMOS transistor (MP 2 ) 406 is coupled to the drain and the gate of the NMOS transistor (MN 1 ) 408 .
  • the source of the NMOS transistor (MN 1 ) 408 is coupled to ground.
  • the gate of the PMOS transistor (MP 2 ) 406 is coupled to the gate of the PMOS transistor (MP 3 ) 410 .
  • the drain of the PMOS transistor (MP 3 ) 410 is coupled to the MOS switch (S 1 ) 412 .
  • the MOS switch (S 1 ) 412 is coupled to the output for drag and the MOS switch (S 2 ) 414 .
  • the MOS switch (S 2 ) 414 is coupled to the drain of the NMOS transistor (MN 2 ) 416 .
  • the gate of the NMOS transistor (MN 2 ) 416 is coupled to the gate of the NMOS transistor (MN 1 ) 408 , and the source of the NMOS transistor (MN 2 ) 416 is coupled to ground.
  • the gate of the PMOS transistor (MP 3 ) 410 is coupled to the gate of the PMOS transistor (MP 4 ) 418 .
  • the drain of the PMOS transistor (MP 4 ) 418 is coupled to the MOS switch (S 3 ) 420 .
  • the MOS switch (S 3 ) 420 is coupled to the output for I primary and the MOS switch (S 4 ) 422 .
  • the MOS switch (S 4 ) 422 is coupled to the drain of the NMOS transistor (MN 3 ) 424 .
  • the gate of the NMOS transistor (MN 3 ) 424 is coupled to the gate of the NMOS transistor (MN 2 ) 416 , and the source of the NMOS transistor (MN 3 ) 424 is coupled to ground.
  • the current, I 1 , from the current source 404 is an internally generated reference current.
  • the PMOS transistor (MP 1 ) 402 sets the PMOS gate bias voltage.
  • the PMOS transistor (MP 2 ) mirrors the current I 1 down to the NMOS transistors 408 , 416 , and 424 .
  • the NMOS transistor (MN 1 ) sets the NMOS gate bias voltage.
  • the PMOS transistor (MP 3 ) 410 and the NMOS transistor (MN 2 ) 416 generate the drag current, I drag .
  • the PMOS transistor (MP 4 ) 418 and the NMOS transistor (MN 3 ) 424 generate the primary current, I primary .
  • the MOS switch (S 1 ) 412 and the MOS switch (S 4 ) 422 are closed when the primary current is pumping down.
  • the MOS switch (S 2 ) 414 and the MOS switch (S 3 ) 420 are closed when the primary current is pumping up.
  • the effective capacitance multiplication is 1/(1 ⁇ 0.86).
  • the 0.86 value could be any value less than 1.
  • FIG. 5 depicts a graph of the AC transfer function (i.e., voltage vs. frequency) of a filter in the prior art and a filter in one embodiment of the invention.
  • FIG. 5 is from a SPICE level simulation of the loop filter circuitry 300 of FIG. 3 and an equivalent, ideal loop filter circuitry 135 of FIG. 2 .
  • FIG. 5 depicts an AC analysis comparing the loop filter circuitry 300 of FIG. 3 and the loop filter circuitry 135 of FIG. 2 .
  • the loop filter circuitry 300 of FIG. 3 comprises the capacitor 340 with a capacitance of 40 pF.
  • the loop filter circuitry 135 of FIG. 2 comprises the capacitor 240 with a capacitance of 280 pF. Even though the capacitor 340 is less than the capacitor 240 by a factor of seven, FIG. 5 depicts that the zero and pole locations are placed identically.
  • FIG. 6 depicts a graph of VCO control voltage vs. time for a filter in the prior art and a filter in one embodiment of the invention.
  • FIG. 6 depicts a time domain analysis of the charge pump and loop filter combined.
  • FIG. 6 depicts a comparison between the loop filter circuitry 300 of FIG. 3 and the loop filter circuitry 135 of FIG. 2 .
  • the slopes of the voltages for both filters are nearly identical as depicted in FIG. 6 .
  • FIG. 7 depicts a zoomed-in graph of VCO control voltage vs. time for a filter in the prior art and a filter in one embodiment of the invention.
  • FIG. 7 depicts a zoomed in view of FIG. 6 .
  • FIG. 7 shows that even though the drag current of the loop filter circuitry 300 of FIG. 3 is delivered in a discrete time fashion, the voltages track in continuous time and are essentially indistinguishable between the loop filter circuitry 300 of FIG. 3 and the loop filter circuitry 135 of FIG. 2 .
  • FIGS. 8-9 depict two other embodiments of capacitance multiplication. Unlike the loop filter circuitry 300 of FIG. 3 , the embodiments shown in FIGS. 8-9 use an amplifier.
  • FIG. 8 depicts an illustration of loop filter circuitry 800 in an embodiment of capacitance multiplication.
  • the loop filter circuitry 800 includes a capacitor 810 , a capacitor 820 , a resistor 832 , a resistor 834 , and an operational amplifier 836 .
  • the capacitor 810 is connected to the integration node 840 and ground.
  • the integration node 840 is connected to the positive terminal of the operational amplifier 836 and the resistor 832 .
  • the resistor 832 is also connected to the V CTRL input 805 and the resistor 834 .
  • the resistor 834 is connected to the negative terminal of the operational amplifier 836 and the feedback link 838 .
  • the feedback link 838 is also connected to the output of the operational amplifier 836 .
  • the capacitor 820 is connected to the resistor 832 , the resistor 834 , the V CTRL input 805 , and ground.
  • the two resistors 832 and 834 with a fixed ratio (i.e. 7 to 1) and an operational amplifier 836 implement the drag current.
  • the fixed ratio may be arbitrarily high as long as there is sufficient accuracy in the drag current generation circuitry to ensure proper PLL functionality. The accuracy requirement increases in an exponential fashion making it fairly difficult to realize very large ratios.
  • the 7 ⁇ resistor 832 is connected to the capacitor 810 (i.e. “big cap”), and the 1 ⁇ resistor 834 is connected to the negative terminal of the operational amplifier 836 connected as a voltage follower.
  • the integration node 840 is connected to the positive terminal of the operational amplifier 836 . Therefore, in this example, the operational amplifier 836 sinks 7 ⁇ 8 of the charge pump current, and the voltage change on the capacitor 810 (i.e. “big cap”) is only 1 ⁇ 8 of that expected by the PLL.
  • FIG. 9 depicts an illustration of loop filter circuitry 900 in an embodiment of capacitance multiplication.
  • the loop filter circuitry 900 includes a capacitor 910 , a capacitor 920 , a resistor 930 , and a “Miller effect” amplifier 942 .
  • the capacitor 910 is connected to the integration node 950 and a feedback link 946 .
  • the capacitor 920 is connected to the V CTRL input 905 , the resistor 930 , and ground.
  • the resistor 930 is connected to the integration node 950 .
  • the integration node 950 is connected to the positive terminal of the “Miller effect” amplifier 942 .
  • the V REF input 944 is connected to the negative terminal of the “Miller effect” amplifier 942 .
  • the output of the “Miller effect” amplifier 942 is connected to the feedback link 946 .
  • the “Miller effect” amplifier 942 generates the drag current.
  • the “Miller effect” amplifier 942 includes an inverting amplifier.
  • the bottom terminal of the capacitor 910 i.e. “big cap” is connected to the output of the amplifier 942 instead of ground. Therefore, if a 7 ⁇ current is delivered to the loop filter circuitry 900 , the amplifier 942 adjusts the bottom plate voltage of the capacitor 910 (i.e. “big cap”), so that only 1/7 of the voltage change is seen by the voltage controlled oscillator whose input is connected to the output of the loop filter circuitry 900 (Node 905 , V CTRL ).
  • the active circuits of FIGS. 8 and 9 determine how much charge is being delivered to the integration node and then replace some portion of the charge so that the voltage change due to the charge pump current appears to be due to a larger capacitance.
  • the drag current circuitry in FIGS. 8 and 9 operates in continuous time and may have negative effects on PLL performance such as increased jitter, increased power consumption, and inaccurate drag current generation across process corners and operating conditions.

Abstract

Phase-locked loop circuitry includes charge pump circuitry, loop filter circuitry, and drag current circuitry. The charge pump circuitry generates a charge pump current based on a phase of an input signal. The loop filter circuitry receives the charge pump current. The drag current circuitry generates a drag current to draw charge in the opposite direction from the charging current from a loop filter integration capacitor in the loop filter circuitry that does not include voltage sensing circuitry.

Description

BACKGROUND
1. Technical Field
The present invention relates generally to phase-locked loop circuitry and more particularly to phase-locked loop filter capacitance with a drag current.
2. Description of Related Art
Filter circuitry may contain capacitors to filter certain frequencies of a signal. Filter circuitry is used in numerous types of electronic circuits. One type of electronic circuit is a phase-locked loop. A phase-locked loop (PLL) is an electronic circuit with a voltage- or current-driven oscillator that is adjusted to match in phase (and thus lock on) the frequency of an input signal. In addition, PLLs are used to generate a signal, modulate or demodulate a signal, reconstitute a signal with less noise, and multiply or divide a frequency. Examples of applications for PLLs include frequency synthesizers for RF local oscillators or digital clock generation, recovery of small signals that otherwise would be lost in noise, lock-in amplifiers, and recovery of clock timing information from a data stream.
FIG. 1 illustrates phase-locked loop (PLL) circuitry 100 according to the prior art. Phase-frequency detector (PFD) circuitry 110 generates an “up” signal 115 and a “down” signal 120 by comparing the phase difference of an input signal 105 to a feedback signal 160. The PFD circuitry 110 outputs the up signal 115 and the down signal 120 depending on whether or not the phase of the feedback signal 160 lags (needs to speed up) or leads (needs to slow down) when compared to the input signal 105. Charge pump circuitry 125 generates current pulses in a charge pump output signal 130 (e.g., to charge capacitors in loop filter circuitry 135) based on the up signal 115 and the down signal 120. The current pulses generated by the charge pump circuitry 125 have a finite minimum pulse width in order to avoid a “dead-zone” effect. For example, when the input signal 105 and the feedback signal 160 have equal phase, the current pulses of the charge pump output signal 130 have a non-zero equal width. With unequal phase, one of the current pulses of the charge pump output signal 130 is lengthened to correct the phase.
The loop filter circuitry 135 low pass filters the charge pump output signal 130 and generates a filtered control signal 140. Voltage controlled oscillator (VCO) circuitry 145 generates an output signal 150 whose frequency is determined by the voltage of the filtered control signal 140. The PLL circuitry 100 loops the output signal 150 back to the PFD circuitry 110 as the feedback signal 160. Optionally, frequency divider circuitry 155 is placed in the feedback path of the loop to generate the feedback signal 160 and to allow the frequency of the output signal 150 to be a multiple of the input signal 105.
FIG. 2 illustrates loop filter circuitry 135 according to the prior art. The loop filter circuitry 135 depicted in FIG. 2 is an example of a second order loop filter. The loop filter circuitry 135 includes a capacitor 220, a resistor 230, and a capacitor 240. The charge pump circuitry 125 of FIG. 1 is represented in FIG. 2 as a current source 210. The capacitor 220 is connected to the control voltage node 215 and ground. The resistor 230 is connected to the control voltage node 215 and the capacitor 240. The capacitor 240 is also connected to ground. The control voltage node 215 is also connected to the voltage controlled oscillator circuitry 145 of FIG. 1. Due to stability concerns, the capacitor 240 (i.e. big capacitor) is usually at least ten times larger than the capacitor 220 (i.e. small capacitor). Increasing the size of the capacitor 240 with respect to the capacitor 220 improves phase margin, which is often desirable. However, it is also desirable to make the capacitor 220 (i.e., small capacitor) as large as possible to reduce the ripple on the control voltage. Therefore, in order to achieve good phase margin and ripple suppression, the capacitor 240 may need to be very large.
An important factor in PLL design is the loop bandwidth. The loop bandwidth describes characteristics of the PLL such as settling behavior and noise transfer functions. A very low loop bandwidth is desirable to achieve good filtering of reference clock noise and feedback divider noise. This is especially important in fractional-N PLL applications where the value of the feedback divide is constantly changing and large amounts of quantization noise may be introduced into the loop. Low bandwidth is also a requirement for loop stability when low reference clock frequencies are used. It is typically desirable for the loop bandwidth to be at least 10 times lower than that of the reference clock frequency. For fractional-N PLLs, the reference clock frequency to bandwidth ratios on the order of 100:1 may be used.
A PLL designer typically has two alternatives to achieve a lower loop bandwidth. First, the charge pump current can be decreased. However, decreasing the charge pump current increases its noise contribution and becomes increasingly difficult to implement at low levels.
The other alternative for lowering the loop bandwidth is increasing the size of the loop filter integration capacitor (i.e., big capacitor). Consequently, one limitation is the overall size of the PLL increases because of the increased size of the capacitor. In FIG. 2, the capacitor 220 is 17.5 pF, and the capacitor 240 is 280 pF. In this example, one problem is the big capacitor (i.e., the capacitor 240) at 280 pF occupies a significant area on the integrated circuit in order to achieve a low loop bandwidth. Some low bandwidth PLL designs may use off chip discrete components for the loop filter. However, components are increasingly being implemented on-chip to be fully integrated, which further increases the need to minimize area consumed on the integrated circuit.
SUMMARY OF THE INVENTION
The invention addresses the above problems by providing a phase-locked loop circuitry with drag current circuitry. The phase-locked loop circuitry includes charge pump circuitry, loop filter circuitry, and drag current circuitry. The charge pump circuitry generates a charge pump current based on a phase of an input signal. The loop filter circuitry receives the charge pump current. The drag current circuitry generates a drag current to draw charge in the opposite direction from the charging current from a loop filter integration capacitor in the loop filter circuitry that does not include voltage sensing circuitry.
The drag current may be a fraction of the charge pump current. The drag current may be delivered in discrete time. In some embodiments, the drag current circuitry is located within the charge pump circuitry. The drag current circuitry may comprise a current source and/or a resistor. The loop filter circuitry may comprise a first capacitor from a control voltage to ground, a resistor from the control voltage to an integration node, and the loop filter integration capacitor from the integration node to the ground and the drag current circuitry may be connected to the integration node.
A method for operating phase-locked loop circuitry includes the steps of generating a charge pump current in charge pump circuitry based on a phase of an input signal, receiving the charge pump current into loop filter circuitry, and generating a drag current in drag current circuitry to draw charge in the opposite direction from the charging current from a loop filter integration capacitor in the loop filter circuitry.
When implemented in a PLL, the drag current circuitry advantageously allows a designer to lower the loop bandwidth without lowering the charge pump current or increasing the capacitor area. Additionally, the charge pump current can be at a more easily managed signal current level rather than being lowered to an unmanageable level. Some embodiments implemented in a PLL have a significant improvement in power supply noise rejection. Some embodiments implemented in a PLL also have another advantage of a “fast locking” behavior.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is an illustration of phase-locked loop circuitry according to the prior art.
FIG. 2 is an illustration of loop filter circuitry according to the prior art.
FIG. 3 is an illustration of loop filter circuitry in an embodiment of the invention.
FIG. 4 is an illustration of charge pump circuitry in one embodiment of the invention.
FIG. 5 is a graph of the AC transfer function (i.e., voltage vs. frequency) of a filter in the prior art and a filter in one embodiment of the invention.
FIG. 6 is a graph of VCO control voltage vs. time for a filter in the prior art and a filter in one embodiment of the invention.
FIG. 7 is a zoomed-in graph of VCO control voltage vs. time for a filter in the prior art and a filter in one embodiment of the invention.
FIG. 8 is an illustration of loop filter circuitry in an embodiment of capacitance multiplication.
FIG. 9 is an illustration of loop filter circuitry in an embodiment of capacitance multiplication.
DETAILED DESCRIPTION OF THE INVENTION
The embodiments discussed herein are illustrative of examples of the present invention. As these embodiments of the present invention are described with reference to illustrations, various modifications or adaptations of the methods and/or specific structures described may become apparent to those skilled in the art. All such modifications, adaptations, or variations that rely upon the teachings of the present invention, and through which these teachings have advanced the art, are considered to be within the scope of the present invention. Hence, these descriptions and drawings should not be considered in a limiting sense, as it is understood that the present invention is in no way limited to only the embodiments illustrated.
The embodiments discussed herein are described in the context of phase-locked loop circuitry. However, other embodiments of the invention may be implemented in any circuit that implements “an integration function”, which can reduce the size of the integration capacitor. Since the integral of current (C) is charge (Q) and Q=CV, both Q and C can be reduced by the same amount and maintain the same voltage (V). Some examples of this circuitry is analog or switched capacitor filter circuitry. Some of this analog or switched capacitor filter circuitry may operate in discrete or continuous time and may be low pass filters.
FIG. 3 depicts an illustration of loop filter circuitry 300 in an embodiment of the invention. The loop filter circuitry 300 includes a capacitor 320, a resistor 330, and a capacitor 340. The current source 310 represents charge pump circuitry from PLL circuitry as depicted in FIG. 1. One example of charge pump circuitry is described in U.S. patent application Ser. No. 11/264,283, entitled “Phase-Locked Loop Circuitry Using Charge Pumps with Current Mirror Circuitry” filed on Oct. 31, 2005, which is hereby incorporated by reference.
The capacitor 320 is connected to the control voltage node 315 and ground. The resistor 330 is connected to the control voltage node 315, N1. The resistor 330 is connected to the capacitor 340 at a node called the integration node, N2. The capacitor 340 is also connected to ground. In this example, the capacitor 320 has a capacitance of 17.5 pF, and the capacitor 340 has a capacitance of 40 pF.
Drag current circuitry 350 is connected to the integration node, N2, between the resistor 330 and the capacitor 340. The drag current circuitry 350 is any electrical component, combination of electrical components, or circuitry configured to generate a drag current that directs charge in the opposite direction from the charging current from a capacitor in filter circuitry. A drag current is any flow of electricity that directs charge in the opposite direction of the charging current from a capacitor in filter circuitry. In FIG. 3, the drag current, I2, is a fraction of the charge pump current, I1. In FIG. 3, by removing/replacing an amount of charge from the integration node, N2, which is smaller yet proportional to the total charge delivered by the charge pump, the capacitor 340 appears larger by a factor of:
1 ( 1 - ( I 2 I 1 ) )
For example, with a 90% charge removal, a PLL circuit sees a capacitor (i.e. capacitor 340), which is 10× larger than the actual capacitor needed to implement the big capacitance. Therefore, the capacitor (i.e. capacitor 340) appears to have a capacitance that is multiplied as compared to its actual capacitance. As a result, smaller capacitance can be used in the loop filter circuitry 300. For example, in FIG. 3, the capacitor 340 has a capacitance of 40 pF as compared with the capacitor 240 of FIG. 2, which has a capacitance of 280 pF. The overall size of the PLL circuitry will be reduced because the capacitance of the loop filter circuitry 300, specifically the capacitor 340, consumes less area on an integrated circuit.
In this example depicted in FIG. 3, the drag current circuitry 350 comprises a current source 355. In one embodiment, the current source 355 represents the charge pump circuitry of the PLL. In this embodiment, the charge pump circuitry has two outputs: one for charge pump current and the other for the drag current. In some embodiments, the drag current, I2, is a fraction and opposite polarity of the charge pump current, I1. The drag current may be generated using current mirrors in the charge pump circuitry, where the ratio of the transistor size in the current mirror is the same as the ratio of I2 to I1. One example of the charge pump circuitry that generates the charge pump current and the drag current is described below in FIG. 4.
The switches in the charge pump circuitry which enable the delivery of current I2 to node N2 can be enabled at the exact same time as the switches enabling the delivery of current I1 to node N1. Some embodiments of the charge pump circuitry may include feedback circuitry to ensure that the positive and negative currents are equal in magnitude such as within 1-2% across the allowed control voltage range. The drag current circuitry 350 delivers the drag current in discrete time or continuous time. In discrete time, the drag current circuitry 350 can remove the charge during the sampling period, which has benefits with regards to noise and accuracy.
The loop filter circuitry 300 of FIG. 3 does not perform current to voltage to current conversions unlike some prior art circuitries for multiplying capacitance. By not performing the current to voltage to current conversions, the loop filter circuitry 300 can be implemented in low power designs. Also, the loop filter circuitry 300 does not include voltage sensing circuitry such as an amplifier.
When implemented in a PLL, the drag current circuitry 350 advantageously allows a designer to lower the loop bandwidth without lowering the charge pump current or increasing the capacitor area. Additionally, the charge pump current can be at a more easily managed signal current level rather than being lowered to an unmanageable level.
Some embodiments implemented in a PLL have a significant improvement in power supply noise rejection. A prior art PLL typically rejects supply noise below its loop bandwidth and above the “short circuit” impedance of the small loop filter capacitor (i.e., ripple capacitor). However, in a prior art PLL, the ranges at low loop bandwidth will not overlap if the ripple capacitor is too small and a passband is created where supply noise can reach the output. In contrast, some embodiments have a loop filter short circuit impedance that is reduced below the loop bandwidth without a negative effect on stability. As a result, the entire frequency spectrum of supply noise is filtered out, and jitter is greatly reduced.
Some embodiments implemented in a PLL also have another advantage of a “fast locking” behavior. Prior art low bandwidth PLLs typically take a very long time to acquire phase lock. However, some embodiments reduce the drag current during the acquisition period which effectively increases the bandwidth at a cost of phase margin. In these embodiments, the loop remains stable enough to obtain phase lock at which the full drag current may be resumed to implement the low loop bandwidth.
There are numerous variations and configurations of electrical components such as resistors, capacitors, and current sources that can be used in the drag current circuitry 350 to generate a drag current that directs charge in the opposite direction from the charging current from a capacitor in filter circuitry.
FIG. 4 depicts an illustration of charge pump circuitry 400 in one embodiment of the invention. The charge pump circuitry 400 generates the primary current, Iprimary, and the drag current, Idrag. The charge pump circuitry 400 includes a PMOS transistor (MP1) 402, a current source 404, a PMOS transistor (MP2) 406, an NMOS transistor (MN1) 408, a PMOS transistor (MP3) 410, a MOS switch (S1) 412, a MOS switch (S2) 414, an NMOS transistor (MN2) 416, a PMOS transistor (MP4) 418, a MOS switch (S3) 420, a MOS switch (S4) 422, and an NMOS transistor (MN3) 424.
The gate of the PMOS transistor (MP1) 402 is coupled to the drain of the PMOS transistor (MP1) 402 and the gate of the PMOS transistor (MP2) 406. The drain of the PMOS transistor (MP2) 406 is coupled to the drain and the gate of the NMOS transistor (MN1) 408. The source of the NMOS transistor (MN1) 408 is coupled to ground.
The gate of the PMOS transistor (MP2) 406 is coupled to the gate of the PMOS transistor (MP3) 410. The drain of the PMOS transistor (MP3) 410 is coupled to the MOS switch (S1) 412. The MOS switch (S1) 412 is coupled to the output for drag and the MOS switch (S2) 414. The MOS switch (S2) 414 is coupled to the drain of the NMOS transistor (MN2) 416. The gate of the NMOS transistor (MN2) 416 is coupled to the gate of the NMOS transistor (MN1) 408, and the source of the NMOS transistor (MN2) 416 is coupled to ground.
The gate of the PMOS transistor (MP3) 410 is coupled to the gate of the PMOS transistor (MP4) 418. The drain of the PMOS transistor (MP4) 418 is coupled to the MOS switch (S3) 420. The MOS switch (S3) 420 is coupled to the output for Iprimary and the MOS switch (S4) 422. The MOS switch (S4) 422 is coupled to the drain of the NMOS transistor (MN3) 424. The gate of the NMOS transistor (MN3) 424 is coupled to the gate of the NMOS transistor (MN2) 416, and the source of the NMOS transistor (MN3) 424 is coupled to ground.
The current, I1, from the current source 404 is an internally generated reference current. The PMOS transistor (MP1) 402 sets the PMOS gate bias voltage. The PMOS transistor (MP2) mirrors the current I1 down to the NMOS transistors 408, 416, and 424. The NMOS transistor (MN1) sets the NMOS gate bias voltage. The PMOS transistor (MP3) 410 and the NMOS transistor (MN2) 416 generate the drag current, Idrag. The PMOS transistor (MP4) 418 and the NMOS transistor (MN3) 424 generate the primary current, Iprimary. The MOS switch (S1) 412 and the MOS switch (S4) 422 are closed when the primary current is pumping down. The MOS switch (S2) 414 and the MOS switch (S3) 420 are closed when the primary current is pumping up.
In this example in FIG. 4, the effective capacitance multiplication is 1/(1−0.86). The 0.86 value could be any value less than 1.
FIG. 5 depicts a graph of the AC transfer function (i.e., voltage vs. frequency) of a filter in the prior art and a filter in one embodiment of the invention. FIG. 5 is from a SPICE level simulation of the loop filter circuitry 300 of FIG. 3 and an equivalent, ideal loop filter circuitry 135 of FIG. 2. FIG. 5 depicts an AC analysis comparing the loop filter circuitry 300 of FIG. 3 and the loop filter circuitry 135 of FIG. 2. As discussed above, the loop filter circuitry 300 of FIG. 3 comprises the capacitor 340 with a capacitance of 40 pF. The loop filter circuitry 135 of FIG. 2 comprises the capacitor 240 with a capacitance of 280 pF. Even though the capacitor 340 is less than the capacitor 240 by a factor of seven, FIG. 5 depicts that the zero and pole locations are placed identically.
FIG. 6 depicts a graph of VCO control voltage vs. time for a filter in the prior art and a filter in one embodiment of the invention. FIG. 6 depicts a time domain analysis of the charge pump and loop filter combined. FIG. 6 depicts a comparison between the loop filter circuitry 300 of FIG. 3 and the loop filter circuitry 135 of FIG. 2. The slopes of the voltages for both filters are nearly identical as depicted in FIG. 6.
FIG. 7 depicts a zoomed-in graph of VCO control voltage vs. time for a filter in the prior art and a filter in one embodiment of the invention. FIG. 7 depicts a zoomed in view of FIG. 6. FIG. 7 shows that even though the drag current of the loop filter circuitry 300 of FIG. 3 is delivered in a discrete time fashion, the voltages track in continuous time and are essentially indistinguishable between the loop filter circuitry 300 of FIG. 3 and the loop filter circuitry 135 of FIG. 2.
FIGS. 8-9 depict two other embodiments of capacitance multiplication. Unlike the loop filter circuitry 300 of FIG. 3, the embodiments shown in FIGS. 8-9 use an amplifier. FIG. 8 depicts an illustration of loop filter circuitry 800 in an embodiment of capacitance multiplication. The loop filter circuitry 800 includes a capacitor 810, a capacitor 820, a resistor 832, a resistor 834, and an operational amplifier 836. The capacitor 810 is connected to the integration node 840 and ground. The integration node 840 is connected to the positive terminal of the operational amplifier 836 and the resistor 832. The resistor 832 is also connected to the VCTRL input 805 and the resistor 834. The resistor 834 is connected to the negative terminal of the operational amplifier 836 and the feedback link 838. The feedback link 838 is also connected to the output of the operational amplifier 836. The capacitor 820 is connected to the resistor 832, the resistor 834, the VCTRL input 805, and ground.
In FIG. 8, the two resistors 832 and 834 with a fixed ratio (i.e. 7 to 1) and an operational amplifier 836 implement the drag current. In other embodiments, the fixed ratio may be arbitrarily high as long as there is sufficient accuracy in the drag current generation circuitry to ensure proper PLL functionality. The accuracy requirement increases in an exponential fashion making it fairly difficult to realize very large ratios. The 7× resistor 832 is connected to the capacitor 810 (i.e. “big cap”), and the 1× resistor 834 is connected to the negative terminal of the operational amplifier 836 connected as a voltage follower. The integration node 840 is connected to the positive terminal of the operational amplifier 836. Therefore, in this example, the operational amplifier 836 sinks ⅞ of the charge pump current, and the voltage change on the capacitor 810 (i.e. “big cap”) is only ⅛ of that expected by the PLL.
FIG. 9 depicts an illustration of loop filter circuitry 900 in an embodiment of capacitance multiplication. The loop filter circuitry 900 includes a capacitor 910, a capacitor 920, a resistor 930, and a “Miller effect” amplifier 942. The capacitor 910 is connected to the integration node 950 and a feedback link 946. The capacitor 920 is connected to the VCTRL input 905, the resistor 930, and ground. The resistor 930 is connected to the integration node 950. The integration node 950 is connected to the positive terminal of the “Miller effect” amplifier 942. The VREF input 944 is connected to the negative terminal of the “Miller effect” amplifier 942. The output of the “Miller effect” amplifier 942 is connected to the feedback link 946.
In FIG. 9, the “Miller effect” amplifier 942 generates the drag current. The “Miller effect” amplifier 942 includes an inverting amplifier. The bottom terminal of the capacitor 910 (i.e. “big cap”) is connected to the output of the amplifier 942 instead of ground. Therefore, if a 7× current is delivered to the loop filter circuitry 900, the amplifier 942 adjusts the bottom plate voltage of the capacitor 910 (i.e. “big cap”), so that only 1/7 of the voltage change is seen by the voltage controlled oscillator whose input is connected to the output of the loop filter circuitry 900 (Node 905, VCTRL).
The active circuits of FIGS. 8 and 9 determine how much charge is being delivered to the integration node and then replace some portion of the charge so that the voltage change due to the charge pump current appears to be due to a larger capacitance. The drag current circuitry in FIGS. 8 and 9 operates in continuous time and may have negative effects on PLL performance such as increased jitter, increased power consumption, and inaccurate drag current generation across process corners and operating conditions.
The above description is illustrative and not restrictive. Many variations of the invention will become apparent to those of skill in the art upon review of this disclosure. The scope of the invention should, therefore, be determined not with reference to the above description, but instead should be determined with reference to the appended claims along with their full scope of equivalents.

Claims (2)

1. Phase-locked loop circuitry comprising:
charge pump circuitry configured to generate a pump current based on a phase of an input signal;
loop filter circuitry configured to receive the charge pump current, the loop filter circuitry comprises a first capacitor connected between a control voltage and ground, a first resistor connected between the control voltage and an integration node, an operational amplifier having a positive terminal connected to the integration node, a second capacitor connected between the integration node and ground, a second resistor between the control voltage and a negative terminal of the operation amplifier, and a feedback link connecting an output of the operational amplifier to the negative terminal of the operational amplifier; and
the first resistor, the second resistor, and the operational amplifier form drag current circuitry configured to generate a drag current to draw charge in the opposite direction from the charging current from the first capacitor.
2. The phase-locked loop circuitry of claim 1 wherein the first resistor and the second resistor are configured to have a fixed ratio.
US11/400,495 2006-04-06 2006-04-06 Phase-locked loop filter capacitance with a drag current Expired - Fee Related US7567133B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US11/400,495 US7567133B2 (en) 2006-04-06 2006-04-06 Phase-locked loop filter capacitance with a drag current
PCT/US2007/008474 WO2007117543A2 (en) 2006-04-06 2007-04-03 Phase-locked loop filter capacitance with a drag current
TW096112073A TWI419470B (en) 2006-04-06 2007-04-04 Phase-locked loop filter capacitance with a drag current

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/400,495 US7567133B2 (en) 2006-04-06 2006-04-06 Phase-locked loop filter capacitance with a drag current

Publications (2)

Publication Number Publication Date
US20070247236A1 US20070247236A1 (en) 2007-10-25
US7567133B2 true US7567133B2 (en) 2009-07-28

Family

ID=38581618

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/400,495 Expired - Fee Related US7567133B2 (en) 2006-04-06 2006-04-06 Phase-locked loop filter capacitance with a drag current

Country Status (3)

Country Link
US (1) US7567133B2 (en)
TW (1) TWI419470B (en)
WO (1) WO2007117543A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8723567B1 (en) 2011-11-01 2014-05-13 Yen Dang Adjustable pole and zero location for a second order low pass filter used in a phase lock loop circuit

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8629700B2 (en) 2012-01-19 2014-01-14 Qualcomm Incorporated Capacitive multiplication in a phase locked loop
US10078231B2 (en) * 2016-07-27 2018-09-18 Elwha Llc Ophthalmic devices and related methods
US11316524B1 (en) * 2020-12-02 2022-04-26 Centaur Technology, Inc. Process independent spread spectrum clock generator utilizing a discrete-time capacitance multiplying loop filter

Citations (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3969678A (en) * 1974-07-08 1976-07-13 Fujitsu Ltd. Band pass filter circuit with automatic bandwidth adjust
EP0405523A2 (en) 1989-06-27 1991-01-02 Sony Corporation Charge pump circuit
EP0484059A2 (en) 1990-10-31 1992-05-06 Plessey Semiconductors Limited Charge pump circuit
US5233314A (en) 1992-03-27 1993-08-03 Cyrix Corporation Integrated charge-pump phase-locked loop circuit
US5274601A (en) 1991-11-08 1993-12-28 Hitachi, Ltd. Semiconductor integrated circuit having a stand-by current reducing circuit
US5362990A (en) 1993-06-02 1994-11-08 Motorola, Inc. Charge pump with a programmable pump current and system
US5434535A (en) * 1992-07-29 1995-07-18 S.G.S. Thomson Microelectronics S.R.L. RC filter for low and very low frequency applications
US5473283A (en) 1994-11-07 1995-12-05 National Semiconductor Corporation Cascode switched charge pump circuit
US5486774A (en) 1991-11-26 1996-01-23 Nippon Telegraph And Telephone Corporation CMOS logic circuits having low and high-threshold voltage transistors
US5508660A (en) 1993-10-05 1996-04-16 International Business Machines Corporation Charge pump circuit with symmetrical current output for phase-controlled loop system
EP0755120A1 (en) 1995-07-18 1997-01-22 Nec Corporation Phase-locked loop circuit
US5973552A (en) 1996-11-04 1999-10-26 Mosaid Technologies Incorporated Power savings technique in solid state integrated circuits
US6046627A (en) 1997-02-28 2000-04-04 Hitachi, Ltd. Semiconductor device capable of operating stably with reduced power consumption
US6124755A (en) 1997-09-29 2000-09-26 Intel Corporation Method and apparatus for biasing a charge pump
US6160432A (en) 1999-04-30 2000-12-12 Conexant Systems, Inc. Source-switched or gate-switched charge pump having cascoded output
US6278332B1 (en) 2000-02-15 2001-08-21 Agere Systems Guardian Corp. Charge pump for low-voltage, low-jitter phase locked loops
US6316987B1 (en) 1999-10-22 2001-11-13 Velio Communications, Inc. Low-power low-jitter variable delay timing circuit
US6329874B1 (en) 1998-09-11 2001-12-11 Intel Corporation Method and apparatus for reducing standby leakage current using a leakage control transistor that receives boosted gate drive during an active mode
US20020041196A1 (en) 1999-02-12 2002-04-11 Paul Demone Delay locked loop
US20020149429A1 (en) * 2001-04-11 2002-10-17 Sander Wendell B. PLL bandwidth switching
US6512404B2 (en) 2001-05-25 2003-01-28 Infineon Technologies Ag Low voltage charge pump for use in a phase locked loop
EP1292032A1 (en) 2000-06-05 2003-03-12 Mitsubishi Denki Kabushiki Kaisha Synchronous device
US6535051B2 (en) 2000-06-09 2003-03-18 Samsung Electronics Co., Ltd. Charge pump circuit
US6603340B2 (en) 2000-08-01 2003-08-05 Sony Corporation Delay circuit, voltage-controlled delay circuit, voltage-controlled oscillation circuit, delay adjustment circuit, DLL circuit, and PLL circuit
US6617936B2 (en) 2001-02-20 2003-09-09 Velio Communications, Inc. Phase controlled oscillator
US6631502B2 (en) 2002-01-16 2003-10-07 International Business Machines Corporation Method of analyzing integrated circuit power distribution in chips containing voltage islands
US20030189991A1 (en) * 2002-04-04 2003-10-09 Gianni Puccio Charge pump phase locked loop
US6636098B1 (en) 2001-12-05 2003-10-21 Rambus Inc. Differential integrator and related circuitry
US6664829B1 (en) 2002-09-04 2003-12-16 National Semiconductor Corporation Charge pump using dynamic charge balance compensation circuit and method of operation
US6667641B1 (en) 1998-11-03 2003-12-23 Altera Corporation Programmable phase shift circuitry
US6710665B2 (en) 2001-01-26 2004-03-23 True Circuits, Inc. Phase-locked loop with conditioned charge pump output
US20040057546A1 (en) 2002-06-25 2004-03-25 Franck Badets Variable phase-shifting circuit, phase interpolator incorporating it, and digital frequency synthesizer incorporating such an interpolator
US20040066220A1 (en) 2002-10-03 2004-04-08 Chun-Chieh Chen High-speed high-current programmable charge-pump circuit
US20040085106A1 (en) 2002-08-26 2004-05-06 Integrant Technologies Inc. Charge pump circuit for compensating mismatch of output currents
US6741110B2 (en) 2002-05-28 2004-05-25 Lsi Logic Corporation Method and/or circuit for generating precision programmable multiple phase angle clocks
US6744292B2 (en) 2002-10-25 2004-06-01 Exar Corporation Loop filter capacitor multiplication in a charge pump circuit
US6771114B2 (en) 2001-09-10 2004-08-03 Nec Electronics Corporation Charge pump current compensating circuit
US6838901B2 (en) 1993-01-07 2005-01-04 Hitachi, Ltd. Semiconductor integrated circuits with power reduction mechanism
US6853253B2 (en) 2002-01-03 2005-02-08 Alcatel Load pump with an extremely wide output voltage
US20050068076A1 (en) 2003-09-26 2005-03-31 Echere Iroaga Current mirror compensation circuit and method
US6924992B2 (en) 2000-09-05 2005-08-02 Electricite De France (Service National) Method and device for controlling power supply
US20050195003A1 (en) 2004-03-05 2005-09-08 Soe Zaw M. Charge pump circuit using active feedback controlled current sources
US6954511B2 (en) 2000-09-21 2005-10-11 Sony Corporation Phase-locked loop circuit and delay-locked loop circuit
US20050237120A1 (en) * 2004-04-26 2005-10-27 Kwang-Il Park Phase-locked loop integrated circuits having fast phase locking characteristics
US20060017476A1 (en) * 2004-07-22 2006-01-26 Seok-Min Jung Phase locked loop integrated circuits having fast locking characteristics and methods of operating same
US20060022727A1 (en) 2004-08-02 2006-02-02 Ju-Hyung Kim Charge pump with balanced and constant up and down currents
US20060119404A1 (en) * 2004-12-07 2006-06-08 Via Technologies, Inc. Phase locked loop circuit
US7092689B1 (en) 2003-09-11 2006-08-15 Xilinx Inc. Charge pump having sampling point adjustment
US20070018701A1 (en) 2005-07-20 2007-01-25 M/A-Com, Inc. Charge pump apparatus, system, and method
US7176733B2 (en) 2003-12-11 2007-02-13 Mosaid Technologies, Inc. High output impedance charge pump for PLL/DLL
US20070090882A1 (en) * 2003-06-17 2007-04-26 Mikael Guenais Phase locked loop filter
US7339420B2 (en) * 2004-07-27 2008-03-04 Matsushita Electric Industrial Co., Ltd. Method of switching PLL characteristics and PLL circuit
US7429854B2 (en) * 2004-11-02 2008-09-30 Nec Electronics Corporation CMOS current mirror circuit and reference current/voltage circuit

Patent Citations (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3969678A (en) * 1974-07-08 1976-07-13 Fujitsu Ltd. Band pass filter circuit with automatic bandwidth adjust
EP0405523A2 (en) 1989-06-27 1991-01-02 Sony Corporation Charge pump circuit
EP0484059A2 (en) 1990-10-31 1992-05-06 Plessey Semiconductors Limited Charge pump circuit
US5274601A (en) 1991-11-08 1993-12-28 Hitachi, Ltd. Semiconductor integrated circuit having a stand-by current reducing circuit
US5486774A (en) 1991-11-26 1996-01-23 Nippon Telegraph And Telephone Corporation CMOS logic circuits having low and high-threshold voltage transistors
US5233314A (en) 1992-03-27 1993-08-03 Cyrix Corporation Integrated charge-pump phase-locked loop circuit
US5434535A (en) * 1992-07-29 1995-07-18 S.G.S. Thomson Microelectronics S.R.L. RC filter for low and very low frequency applications
US6838901B2 (en) 1993-01-07 2005-01-04 Hitachi, Ltd. Semiconductor integrated circuits with power reduction mechanism
US5362990A (en) 1993-06-02 1994-11-08 Motorola, Inc. Charge pump with a programmable pump current and system
US5508660A (en) 1993-10-05 1996-04-16 International Business Machines Corporation Charge pump circuit with symmetrical current output for phase-controlled loop system
US5473283A (en) 1994-11-07 1995-12-05 National Semiconductor Corporation Cascode switched charge pump circuit
EP0755120A1 (en) 1995-07-18 1997-01-22 Nec Corporation Phase-locked loop circuit
US5973552A (en) 1996-11-04 1999-10-26 Mosaid Technologies Incorporated Power savings technique in solid state integrated circuits
US6046627A (en) 1997-02-28 2000-04-04 Hitachi, Ltd. Semiconductor device capable of operating stably with reduced power consumption
US6124755A (en) 1997-09-29 2000-09-26 Intel Corporation Method and apparatus for biasing a charge pump
US6329874B1 (en) 1998-09-11 2001-12-11 Intel Corporation Method and apparatus for reducing standby leakage current using a leakage control transistor that receives boosted gate drive during an active mode
US6667641B1 (en) 1998-11-03 2003-12-23 Altera Corporation Programmable phase shift circuitry
US20020041196A1 (en) 1999-02-12 2002-04-11 Paul Demone Delay locked loop
US6160432A (en) 1999-04-30 2000-12-12 Conexant Systems, Inc. Source-switched or gate-switched charge pump having cascoded output
US6316987B1 (en) 1999-10-22 2001-11-13 Velio Communications, Inc. Low-power low-jitter variable delay timing circuit
US6278332B1 (en) 2000-02-15 2001-08-21 Agere Systems Guardian Corp. Charge pump for low-voltage, low-jitter phase locked loops
EP1292032A1 (en) 2000-06-05 2003-03-12 Mitsubishi Denki Kabushiki Kaisha Synchronous device
US6535051B2 (en) 2000-06-09 2003-03-18 Samsung Electronics Co., Ltd. Charge pump circuit
US6603340B2 (en) 2000-08-01 2003-08-05 Sony Corporation Delay circuit, voltage-controlled delay circuit, voltage-controlled oscillation circuit, delay adjustment circuit, DLL circuit, and PLL circuit
US6924992B2 (en) 2000-09-05 2005-08-02 Electricite De France (Service National) Method and device for controlling power supply
US6954511B2 (en) 2000-09-21 2005-10-11 Sony Corporation Phase-locked loop circuit and delay-locked loop circuit
US6710665B2 (en) 2001-01-26 2004-03-23 True Circuits, Inc. Phase-locked loop with conditioned charge pump output
US6861916B2 (en) 2001-02-20 2005-03-01 Rambus Inc. Phase controlled oscillator circuit with input signal coupler
US6617936B2 (en) 2001-02-20 2003-09-09 Velio Communications, Inc. Phase controlled oscillator
US20020149429A1 (en) * 2001-04-11 2002-10-17 Sander Wendell B. PLL bandwidth switching
US6512404B2 (en) 2001-05-25 2003-01-28 Infineon Technologies Ag Low voltage charge pump for use in a phase locked loop
US6771114B2 (en) 2001-09-10 2004-08-03 Nec Electronics Corporation Charge pump current compensating circuit
US6636098B1 (en) 2001-12-05 2003-10-21 Rambus Inc. Differential integrator and related circuitry
US6853253B2 (en) 2002-01-03 2005-02-08 Alcatel Load pump with an extremely wide output voltage
US6631502B2 (en) 2002-01-16 2003-10-07 International Business Machines Corporation Method of analyzing integrated circuit power distribution in chips containing voltage islands
US20030189991A1 (en) * 2002-04-04 2003-10-09 Gianni Puccio Charge pump phase locked loop
US6741110B2 (en) 2002-05-28 2004-05-25 Lsi Logic Corporation Method and/or circuit for generating precision programmable multiple phase angle clocks
US20040057546A1 (en) 2002-06-25 2004-03-25 Franck Badets Variable phase-shifting circuit, phase interpolator incorporating it, and digital frequency synthesizer incorporating such an interpolator
US20040085106A1 (en) 2002-08-26 2004-05-06 Integrant Technologies Inc. Charge pump circuit for compensating mismatch of output currents
US6664829B1 (en) 2002-09-04 2003-12-16 National Semiconductor Corporation Charge pump using dynamic charge balance compensation circuit and method of operation
US20040066220A1 (en) 2002-10-03 2004-04-08 Chun-Chieh Chen High-speed high-current programmable charge-pump circuit
US6744292B2 (en) 2002-10-25 2004-06-01 Exar Corporation Loop filter capacitor multiplication in a charge pump circuit
US20070090882A1 (en) * 2003-06-17 2007-04-26 Mikael Guenais Phase locked loop filter
US7092689B1 (en) 2003-09-11 2006-08-15 Xilinx Inc. Charge pump having sampling point adjustment
US20050068076A1 (en) 2003-09-26 2005-03-31 Echere Iroaga Current mirror compensation circuit and method
US7176733B2 (en) 2003-12-11 2007-02-13 Mosaid Technologies, Inc. High output impedance charge pump for PLL/DLL
US20050195003A1 (en) 2004-03-05 2005-09-08 Soe Zaw M. Charge pump circuit using active feedback controlled current sources
US20050237120A1 (en) * 2004-04-26 2005-10-27 Kwang-Il Park Phase-locked loop integrated circuits having fast phase locking characteristics
US20060017476A1 (en) * 2004-07-22 2006-01-26 Seok-Min Jung Phase locked loop integrated circuits having fast locking characteristics and methods of operating same
US7339420B2 (en) * 2004-07-27 2008-03-04 Matsushita Electric Industrial Co., Ltd. Method of switching PLL characteristics and PLL circuit
US20060022727A1 (en) 2004-08-02 2006-02-02 Ju-Hyung Kim Charge pump with balanced and constant up and down currents
US7429854B2 (en) * 2004-11-02 2008-09-30 Nec Electronics Corporation CMOS current mirror circuit and reference current/voltage circuit
US20060119404A1 (en) * 2004-12-07 2006-06-08 Via Technologies, Inc. Phase locked loop circuit
US20070018701A1 (en) 2005-07-20 2007-01-25 M/A-Com, Inc. Charge pump apparatus, system, and method

Non-Patent Citations (23)

* Cited by examiner, † Cited by third party
Title
Calhoun B., "A Leakage Reduction Methodology for Dtistributed MTCMOS," IEEE Journal of Solid-state Circuits, vol. 39, No. 5, May 2004, pp. 818-826.
Das K. and R. Brown, Ultra Low-Leakage Power Strategies for Sub-1 V VLSI: Novel Circuit Styles and Design Methodologies for Partially Depleted Sil 2003.
Duque-Carrillo, J.F. et al., "1-V Rail-to-Rail Operational Amplifiers in Standard CMOS Technology," Jan. 2000, IEEE Journal of Solid-State Circuits, vol. 35(1).
Halter J. and F. Najm, "A Gate-Level Leakage Power Reduction Method for Ultra-Low-Power CMOS Circuits," IEEE Customs Integrated Circuits Conference, 1997, pp. 475-478.
Horiguchi M., et al., "Switched-Source-Impedance CMOS Circuit For Low Standby Subthreshold Current Giga-Scale LSI's," IEEE Journal of Solid-State Circuits, vol. 28, No. 11, No, Nov. 1993.
Inukai T., et al., "Boosted Gate MOS (BGMOS): Device/Circuit Cooperating Scheme to Achieve Leakage-Free Giga-Scale Integration," Custom Integrated Circuits Conference, 2000.CI.
Inukai T., et al., "Boosted Gate MOS (BGMOS): Device/Circuit Cooperation Scheme to Achieve Leakage-Free Giga-Scale Integration," Custom Integrated Circuits Conference, 2000.CI.
Jack Ou & M.F. Caggiano, Loop Filter Design Considerations for Clock and Data Recovery Circuits, 2003, IEEE, 0-7803-7778-8/03, p. 84. *
Jack Ou and M F Caggiano, Loop Filter Design Considerations for Clock and Data Recovery Circuits, 2003, IEEE, pp. 81 & 85. *
Kao J. and A. Chandrakasan, "Dual-Threshold Voltage Techniques for Low-Power Digital Circuits," IEEE Journal of Solid-state Circuits, vol. 35, No. 7, Jul. 2000, pp. 1009-1018.
Kawaguchi H., et al., "A CMOS Scheme for 0.5V Supply Voltage with Pico-Ampere Standby Current," Solid-State Circuits Conference 1998. Digest of Technical Papers. 45th ISSCC 1.
Kawaguchi H., et al., "A Super Cut-Off CMOS (SCCMOS) Scheme for 0.5-V Supply Voltage with Picoampere Stand-By Current," IEEE Journal of Solid-State Circuits, vol. 35, No. 10, Oct. 2000.
Kim, C.H. et al., "A 64-Mbit, 640-Mbyte/s Bidirectional Data Strobed, Double-Data-Rate SDRAM with a 40-mW DLL for a 256-Mbyte Memory System," Nov. 1998, IEEE Journal of Solid-State Circuits, vol. 33(11).
Lackey D., et al., "Managing Power and Performance for System-on-Chip Designs using Voltage Islands," Computer Aided Design, 2002. ICCAD 2002.IEEE/ACM International Conference.
Larsson, P., "A2-1600MHz 1.2-2.5V CMOS Clock-Recovery PLL with Feedback Phase-Selection and Averaging Phase-Interpolation for Jitter Reduction," 1999, IEEE Journal of Solid-State Circuits Conference.
Maneatis, J. G., "Low-Jitter Process-Independent DLL and PLL Based on Self-Biased Techniques," Nov. 1996, IEEE Journal of Solid-State Circuits, vol. 31(11).
Moon, Y. et al., "An All-Analog Multiphase Delay-Locked Loop Using a Replica Delay Line for Wide-Range Operation and Low-Jitter Performance". Mar. 2000, IEEE Journal of Solid-State Circuits, vol. 35(3).
Mutoh S., et al., "1-V Power Supply High-Speed Digital Circuit Technology with Multithreshold-Voltage CMOS," IEEE Journal of Solid-State Circuits, vol. 30, No. 8, Aug. 1995.
Nose K., et al., "VTH-Hopping Scheme to Reduce Subthreshold Leakage for Low-Power Processors," IEEE Journal of Solid-State Circuits, vol. 37, No. 3, Mar. 2002, pp. 413-415.
PCT/US07/08474, International Search Report and Written Opinion, 9 pages, Sep. 29, 2008.
Samavati, et al., "A Fully-Integrated 5 GHz CMOS Wireless-LAN Receiver", IEEE International Solid-State Circuits Conference, 2001.
US 6,642,753, 11/2003, Choi (withdrawn)
Zhang Z. and Z. Guo, "Active Leakage Control with Sleep Transistors and Body Bias," www.eecs.berkeley.edu/~zyzhang/ee241/final.pdf.

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8723567B1 (en) 2011-11-01 2014-05-13 Yen Dang Adjustable pole and zero location for a second order low pass filter used in a phase lock loop circuit
US8791736B2 (en) * 2011-11-01 2014-07-29 Yen Dang Adjustable pole and zero location for a second order low pass filter used in a phase lock loop circuit

Also Published As

Publication number Publication date
WO2007117543A3 (en) 2008-12-18
WO2007117543A2 (en) 2007-10-18
TW200820625A (en) 2008-05-01
US20070247236A1 (en) 2007-10-25
TWI419470B (en) 2013-12-11

Similar Documents

Publication Publication Date Title
US10720929B1 (en) Integrated circuit with oscillator signal based on switched-resistance circuitry
US10141941B2 (en) Differential PLL with charge pump chopping
US8558592B2 (en) Charge pump and active filter for a feedback circuit
US8773184B1 (en) Fully integrated differential LC PLL with switched capacitor loop filter
US11201625B2 (en) Phase locked loop
JP4837481B2 (en) Phase-locked loop with scaled braking capacitor
US20070103243A1 (en) Relaxation oscillator with propagation delay compensation for improving the linearity and maximum frequency
US8487677B1 (en) Phase locked loop with adaptive biasing
CN110572154A (en) Voltage regulator based loop filter for loop circuit and loop filtering method
US7567133B2 (en) Phase-locked loop filter capacitance with a drag current
EP0945986A2 (en) Charge pump circuit for PLL
JP2018509795A (en) Self-biased charge pump
US8344812B2 (en) Loop filter and voltage controlled oscillator for a phase-locked loop
CN106982057B (en) Phase-locked loop system
CN114301451A (en) Phase-locked loop circuit, control method, charge pump and chip
US20090206893A1 (en) Charge pump circuit and pll circuit
Han et al. A time-constant calibrated phase-locked loop with a fast-locked time
Shin et al. A fast-acquisition PLL using split half-duty sampled feedforward loop filter
US10819350B2 (en) Clock signal generating circuit and method for generating clock signal
JP2003298414A (en) Semiconductor integrated circuit
RU2422985C1 (en) Structure of filter of control circuit for phase automatic frequency control device
CN116318125A (en) Reference sampling phase-locked loop applied to low-voltage mode
US20180183445A1 (en) Low-jitter phase-locked loop circuit
CN111697966A (en) Clock generation circuit and method for generating clock signal
Elangovan Low power and area efficient semi-digital pll architecture for high brandwidth applications

Legal Events

Date Code Title Description
AS Assignment

Owner name: MOSAID TECHNOLOGIES CORPORATION, CALIFORNIA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CAPLAN, RANDY;REEL/FRAME:017775/0760

Effective date: 20060405

FEPP Fee payment procedure

Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

AS Assignment

Owner name: MOSAID TECHNOLOGIES INCORPORATED, CANADA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MOSAID TECHNOLOGIES CORPORATION;REEL/FRAME:025586/0783

Effective date: 20100505

Owner name: MOSAID TECHNOLOGIES INCORPORATED, CANADA

Free format text: CHANGE OF ADDRESS;ASSIGNOR:MOSAID TECHNOLOGIES INCORPORATED;REEL/FRAME:025582/0967

Effective date: 20090209

AS Assignment

Owner name: ROYAL BANK OF CANADA, CANADA

Free format text: U.S. INTELLECTUAL PROPERTY SECURITY AGREEMENT (FOR NON-U.S. GRANTORS) - SHORT FORM;ASSIGNORS:658276 N.B. LTD.;658868 N.B. INC.;MOSAID TECHNOLOGIES INCORPORATED;REEL/FRAME:027512/0196

Effective date: 20111223

FPAY Fee payment

Year of fee payment: 4

AS Assignment

Owner name: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.,

Free format text: CHANGE OF NAME;ASSIGNOR:MOSAID TECHNOLOGIES INCORPORATED;REEL/FRAME:032439/0638

Effective date: 20140101

AS Assignment

Owner name: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.,

Free format text: RELEASE OF SECURITY INTEREST;ASSIGNOR:ROYAL BANK OF CANADA;REEL/FRAME:033484/0344

Effective date: 20140611

Owner name: CONVERSANT IP N.B. 868 INC., CANADA

Free format text: RELEASE OF SECURITY INTEREST;ASSIGNOR:ROYAL BANK OF CANADA;REEL/FRAME:033484/0344

Effective date: 20140611

Owner name: CONVERSANT IP N.B. 276 INC., CANADA

Free format text: RELEASE OF SECURITY INTEREST;ASSIGNOR:ROYAL BANK OF CANADA;REEL/FRAME:033484/0344

Effective date: 20140611

AS Assignment

Owner name: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC., CANADA

Free format text: CHANGE OF ADDRESS;ASSIGNOR:CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.;REEL/FRAME:033678/0096

Effective date: 20140820

Owner name: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.,

Free format text: CHANGE OF ADDRESS;ASSIGNOR:CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.;REEL/FRAME:033678/0096

Effective date: 20140820

AS Assignment

Owner name: CPPIB CREDIT INVESTMENTS INC., AS LENDER, CANADA

Free format text: U.S. PATENT SECURITY AGREEMENT (FOR NON-U.S. GRANTORS);ASSIGNOR:CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.;REEL/FRAME:033706/0367

Effective date: 20140611

Owner name: ROYAL BANK OF CANADA, AS LENDER, CANADA

Free format text: U.S. PATENT SECURITY AGREEMENT (FOR NON-U.S. GRANTORS);ASSIGNOR:CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.;REEL/FRAME:033706/0367

Effective date: 20140611

REMI Maintenance fee reminder mailed
LAPS Lapse for failure to pay maintenance fees

Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.)

STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Lapsed due to failure to pay maintenance fee

Effective date: 20170728

AS Assignment

Owner name: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC., CANADA

Free format text: RELEASE OF U.S. PATENT AGREEMENT (FOR NON-U.S. GRANTORS);ASSIGNOR:ROYAL BANK OF CANADA, AS LENDER;REEL/FRAME:047645/0424

Effective date: 20180731

Owner name: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.,

Free format text: RELEASE OF U.S. PATENT AGREEMENT (FOR NON-U.S. GRANTORS);ASSIGNOR:ROYAL BANK OF CANADA, AS LENDER;REEL/FRAME:047645/0424

Effective date: 20180731